CRYORIG H7 CPU Air Cooler, Compatibility 1150, 1151, 1155, 1156 FM1, FM2/+, AM2/+, AM3/+, AM4
CRYORIG H7 CPU Cooler
Breaking Design Molds
Efficiency by Innovation
CRYORIG H Series coolers feature our proprietary Hive Fin™ structure. This design allows for a combination of Jet Fin Acceleration™ and Turbulence Reduction, as well as strengthening structural strength of the fin stacks. Combined together, the Hive Fin™ design brings cool innovation.
Air Exhaust Acceleration
Hot Air Cooled Fast
By utilizing a larger air intake and narrower air exhaust section on the fins, compresses the air to move faster while exiting the heatsink. Jet Fin Acceleration System™ carries the hot air out of the system faster and more efficiently.
Turbulence Reduction System
Utilizing a bee hive shaped structure at the front air intake of the heatsink, lowers air turbulence and straightens out the airflow. Assisting airflow to move directly through the full length of the heatsink and carrying out hot air.
Total CPU Coverage
The H7’s Heatpipe Convex-Align™ System allows for more heatpipes in a given area, optimized heatpipe placement in the copper base, and improved alignment with your CPU. With the Heatpipe Convex-Align™ System, each heatpipe functions to their maximum TDP capacity.
Quad Air Inlet™
CRYORIG’s proprietary Quad Air Inlet™ system features four strategically placed aerodynamic air inlet that allows for extra air intake. The additional air intake allows the QF series fan to have a higher air output volume for its fan diameter, which equals better temperatures for your CPU heatsink and more air exchanged for your system case.
Zero RAM Interference
Focusing on providing the widest range of
compatibility, the H7 utilizes an asymmetric slanted
heatpipe layout to move the heatsink away from the
RAM zone, Offering optimal compatibility for RAM
with tall heat spreaders on both Intel™ 115X and
Patent Pending X-Bar™
Quick Mount System
Fast, Easy and Secure
Our new patent-pending X-Bar™ Quick Mount System follows CRYORIG’s renowned mounting system design and provides a quick and secure solution on both Intel™ and AMD platforms. The X-Bar™ system’s dedicated backplate is made from fiberglass augmented PBT, for higher tensile strength, resistance to heat and is more easily recyclable than other plastics. The backplate protects the mainboard from excessive stress that may come from the mounted heatsink, and also provides a solid base for your fast and secure installation.
Dimension ( with fan ) L126 mm x W123 mm x H145 mm
Weight ( with fan ) 711 g
Weight ( without fan ) 577 g
Heat pipes 6mm Heatpipe x 3 units
Fin T = 0.4 mm ; Gap = 2.2 mm
Fin Pcs 40 pcs
Copper Base C1100 Pure copper nickel plated
RAM Height Limit Limitless
TDP 140 W
Model QF120 Balance
Dimension L120 mm x W120 mm x H25.4 mm
Weight 134 g
Rated Speed 300 ~ 1600 RPM ±10 %
Noise Level 25 dBA
Air Flow 59 CFM
Air Pressure 1.65 mmH2O
1150, 1151, 1155, 1156
FM1, FM2/+, AM2/+, AM3/+, AM4